TSMC’s Process Nodes: A Deep Dive into the Future of Smartphone Chips

 

TSMC’s Process Nodes: A Deep Dive into the Future of Smartphone Chips

As the world’s leading semiconductor foundry, Taiwan Semiconductor Manufacturing Company (TSMC) has been at the forefront of advancing chip technology. With each new process node—from 7nm to the upcoming 2nm—TSMC continues to push the boundaries of performance, power efficiency, and transistor density, shaping the future of smartphone chips.

Understanding TSMC’s Process Nodes

7nm (N7) and 7nm+ (N7+)

TSMC’s 7nm process (N7) marked a significant milestone in semiconductor manufacturing, enabling higher transistor densities and improved performance. The subsequent 7nm+ (N7+) process introduced Extreme Ultraviolet (EUV) lithography, offering a 15-20% higher transistor density and 10% lower power consumption compared to N7 .

5nm (N5) and Its Derivatives

The 5nm (N5) process brought further enhancements, with Apple utilizing it for the A14 and A15 Bionic chips . TSMC later introduced N4P, an optimized version of N5, delivering an 11% performance boost, 22% improvement in power efficiency, and 6% higher transistor density compared to N5 .

3nm (N3) and the A17 Pro

In 2023, TSMC commenced mass production of its 3nm (N3) process, with Apple being the first to adopt it for the A17 Pro chip in the iPhone 15 Pro models . The A17 Pro features 19 billion transistors, a 19% increase over its predecessor, and integrates a new six-core GPU with hardware-accelerated ray tracing .

2nm (N2) and the Transition to GAA

Looking ahead, TSMC’s 2nm (N2) process is set to enter volume production in the second half of 2025 . This node will be TSMC’s first to adopt gate-all-around (GAA) nanosheet transistors, promising increased performance and lower leakage. TSMC reports that N2 exhibits a lower defect density than its predecessors at a comparable stage of development, indicating a smoother transition to this new architecture .

Implications for Smartphone Chip Technology

Each advancement in TSMC’s process nodes enables smartphone system-on-chips (SoCs) to achieve higher performance, improved power efficiency, and support for more complex features. Apple, a key TSMC customer, often leads in adopting new nodes, as seen with the A17 Pro on N3. With N2 on the horizon, future chips like the anticipated A19 Pro are expected to deliver significant gains in computational performance and efficiency, particularly in AI workloads and graphics processing .

Beyond Process Nodes: Advanced Packaging and Future Technologies

TSMC is also investing in advanced packaging technologies, such as chip-on-wafer-on-substrate (CoWoS) and 3D stacking, to continue performance scaling beyond traditional node shrinks. These innovations allow for the integration of multiple chiplets, enhancing performance and functionality. Additionally, TSMC has announced plans for its 1.4nm (A14) process, expected to enter production in 2028, offering a 15% speed improvement or a 30% power reduction compared to N2 .

Conclusion

TSMC’s relentless pursuit of innovation in semiconductor manufacturing continues to set the pace for the smartphone industry. As process nodes shrink and new architectures like GAA are adopted, we can anticipate smartphones with unprecedented capabilities, driving the next wave of mobile technology advancements.